AI sits at the center of our EDA tool, replacing rigid rule decks with learned models that map layout to mask and silicon. It predicts context-aware corrections (OPC) and hotspots, cutting manual tuning and speeding DTCO.

A GPU-first pipeline built for very large designs, harnessing massive parallel compute. It scales across GPUs with smart tiling and compressed streaming keep throughput high. Expect order-of-magnitude speedups with stable, predictable runtimes.

We turn design, lithography, and fab data into actionable signals. Features from GDS/OASIS are fused with metrology and test to close the loop from design to manufacturing. Models improve continuously—raising yield and accelerating the ramp to stable high-volume production. 

Rapidly pinpoints potential hotspot regions that conventional OPC struggles to fix, enabling early, targeted intervention.

Correction learns from historical OPC outcomes and generates one-shot, process-constrained correction vectors for critical regions-accelerating convergence and reducing manual tuning.

A unified control plane for all EDA tools: intelligent orchestration, job submission, data collection, hardware monitoring, and full traceability-closing the loop from data to decisions across design and manufacturing.

DFM-oriented optimization using AI-modeled process knowledge to enable secure, efficient information exchange and verification between design and manufacturing-improving printability, yield, and time-to-ramp.

Accelerate shift-left for Hotspot Checking

AI-driven litho-friendly design: prediction and optimization

Pre-correction for Optical Proximity Correction (OPC)